Senior or Principal Technical Program ManagerTexas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative. A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems—catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.This role leads complex multi-disciplinary initiatives that drive innovation in microsystems technology.
By orchestrating collaboration across internal teams and external partners, it ensures strategic alignment, timely execution, and clear communication of progress. The position also plays a key role in shaping program direction through industry insight and proactive problem-solving.Responsibilities include:Leading the planning, execution, and delivery of cross-disciplinary programs supporting TIE's advanced microsystems roadmap.Developing and managing program scopes, schedules, budgets, and risk mitigation plans to ensure predictable delivery across engineering and manufacturing teams.Coordinating efforts across internal R&D, process development, design automation, and partner organizations to align execution with technology and business objectives.Serving as the central liaison between TIE's technical teams, university researchers, and external stakeholders—including DoD partners, national labs, and commercial collaborators.Driving metrics-based accountability and communication across all program tracks to ensure transparency and stakeholder confidence.Identifying dependencies, anticipating bottlenecks, and proactively resolving issues to maintain momentum in a fast-moving environment.Supporting the generation of technical documentation, customer deliverables, and integration roadmaps that communicate progress and align with contract requirements.Monitoring industry trends in advanced packaging, 3DHI, and chiplet-based architectures, informing program direction and partnership strategy.Other related functions as assigned.Required qualifications include:For Senior Technical Program Manager: 8+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.For Principal Technical Program Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.For both levels: BS in Electrical Engineering, Computer Engineering, or a related technical discipline. Proven expertise in advanced packaging technologies and heterogeneous integration techniques. Working knowledge of semiconductor fabrication processes and electronic design automation flows.
Exceptional communication skills. Startup DNA. Execution mindset.Preferred qualifications include:Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field.Program Leadership: Proven program management chops – you can demonstrate end-to-end ownership of complex programs involving multiple customer or partner stakeholders. You know how to define success metrics, manage interdependencies, and keep teams aligned and motivated even as projects grow in complexity.Vendor/Partner Management: Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage deliverables, and hold teams accountable to milestones.Industry Background: Prior experience at a leading semiconductor foundry or packaging house is a strong plus, giving you firsthand insight into advanced packaging processes and the broader industry ecosystem.Salary range is industry-competitive.Working conditions may include standard office conditions, repetitive use of a keyboard, and use of manual dexterity.
Work shift is Monday – Friday: 8am to 5pm, with occasional/frequent nights/weekends required. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible, with travel up to 30–50% as needed.Required materials include:Resume/CV3 work references with their contact information; at least one reference should be from a supervisorLetter of interest
Senior or Principal Technical Program Manager in austin at Unknown Company
This position is listed as contract and hybrid.