Delos Data Inc. is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for AI accelerators. You will own package architecture, substrate design, manufacturability, and engage with vendors such as TSMC/OSAT to enable next-gen products.
You will collaborate with IC design and board teams to ensure system-level package requirements are met, evaluate new packaging technologies, and support bring-up, failure analysis, and qualification.
#J-18808-LjbffrSenior Multi‑Die Packaging Engineer for AI Accelerators in palo alto at Unknown Company
This position is listed as full time and onsite.