RTX is seeking an Engineering Project Leader to guide microelectronics packaging across 2.5D and 3D heterogeneous integration for RF and mixed-signal subsystems. This onsite role can be located in Tewksbury, MA, McKinney, TX, or Goleta, CA, with responsibilities spanning program capture, technical direction, and cross-functional collaboration.
You will lead trade studies, mentor engineers, and drive proposals while managing portfolio investments. A Top Secret clearance is required to start.
#J-18808-LjbffrSenior Microelectronics Packaging Leader (2.5D/3D) in north tewksbury at Unknown Company
This position is listed as full time and onsite.