BAE Systems is seeking an experienced Mechanical Engineer for Microelectronics Packaging in Cedar Rapids, IA. The role blends onsite and remote work, supporting design, development, and manufacturing of next-generation GPS-related packages.
Responsibilities span from concept to factory support; requires a Bachelor’s in Engineering and 4+ years in microelectronics packaging, with a DoD clearance in scope.
#J-18808-LjbffrSenior Microelectronics Packaging Engineer - Hybrid Role in northern at Unknown Company
This position is listed as full time and able to be worked remotely.