Intel Corporation's Advanced Packaging Technology Development Metrology Group in Hillsboro, Oregon seeks a Senior Module Development Engineer to lead next-generation metrology equipment development and end-to-end qualification from installation to fab readiness.
You will work across cross-functional teams, define roadmaps, collaborate with AI and advanced process control groups, and translate industry trends into concrete capabilities that keep Intel ahead of program demand.
#J-18808-LjbffrSenior Metrology Engineer - Packaging Pathfinding in hillsboro at Unknown Company
This position is listed as full time and onsite.