Draper is seeking a Senior Advanced Packaging/MEMS Process Engineer to apply advanced semiconductor and MEMS process knowledge to HSIP and Fan-Out Wafer-Level (FOWL) technologies.
You will collaborate with cross-functional teams to develop, optimize, and qualify processes, lead copper electroplating and etch steps, mentor engineers, and drive high-mix/low-volume manufacturing readiness for 2.5D/3D chiplet integration. This role requires a US security clearance and is based in St. Petersburg, FL.
#J-18808-LjbffrSenior MEMS & HSIP Packaging Process Engineer in saint petersburg at Unknown Company
This position is listed as full time and onsite.