Nokia's Advanced Packaging R&D team seeks a mechanical engineer to drive the development of high‑performance electro‑optic modules and to integrate Silicon Photonics transceivers from concept to new product introduction.
You will design, simulate, and validate packaging architectures, coordinate with vendors, and ensure manufacturability and cost targets are met in a high‑volume setting.
#J-18808-LjbffrSenior Mechanical-Photonic Packaging Engineer in new york at Unknown Company
This position is listed as full time and onsite.