Micron Technology, Inc. is seeking a Senior Materials Engineer/Scientist in Advanced Packaging Technology Development to define and enable materials foundations for next-generation memory and packaging technologies.
You will collaborate with teams to turn scientific insight into technology impact, exploring interfaces, adhesion, and thermal performance, while advancing materials for HBM, 3D memory, and heterogeneous integration.
#J-18808-LjbffrSenior Materials Engineer — Advanced Packaging & 3D Memory in boise at Unknown Company
This position is listed as full time and onsite.