Renesas Electronics in Tempe, AZ seeks a senior packaging leader to drive technology development and NPI for power SiP and interconnect solutions. You will coordinate with OSATs, subcontractors, and cross-functional teams to ensure on-time qualification and robust production transfer.
You will oversee SiC/GaN packaging activities and advanced substrates, while guiding DOE plans, risk assessments, and delivery against targets. A strong track record in power packaging is required.
#J-18808-LjbffrSenior Manager, Power Package Design & NPI in tempe at Unknown Company
This position is listed as contract and onsite.