Annapurna Labs is seeking a Senior Manager to lead a SI/PI team focused on 2.5D/3D packaging for next-generation chiplet platforms. You will set the technical direction for package-level SI/PI across CoWoS, EMIB, and 3D die-stacking, while remaining hands-on with modeling, simulation, and post-silicon correlation.
You will own the SI/PI strategy from architecture through production, partnering with silicon design, physical design, system architecture, and OSAT vendors to ensure robust signaling
#J-18808-LjbffrSenior Manager, Package SI/PI & 3D Chiplet Systems in cupertino at Unknown Company
This position is listed as full time and onsite.