Qualcomm Technologies, Inc. is seeking a hands-on IC packaging FEA engineer in San Diego to advance mechanical simulations for current and future chipsets. You will build and maintain ANSYS models, drive CPI analyses, and influence design decisions across packaging technologies.
The role requires strong communication, project focus, and hands-on experience in semiconductor packaging, reliability testing, and DOE-driven validation. Travel may be occasional as needed.
#J-18808-LjbffrSenior IC Packaging Mechanical Simulation Engineer in san diego at Unknown Company
This position is listed as full time and onsite.