Tessolve Semiconductors is seeking an IC Packaging Design Engineer for Chandler, AZ (primary) with Hillsboro, OR as a secondary option. Senior-level candidates with 10+ years are preferred, but strong 4–6+ years MS or 6+ years BS candidates will be considered.
You will design physical IC packages, drive substrate layouts, and ensure SI/PI-aware implementations while collaborating with cross-functional teams to meet performance, manufacturability, yield, and reliability goals.
#J-18808-LjbffrSenior IC Packaging Design Engineer – XPD/Cadence in chandler at Unknown Company
This position is listed as full time and onsite.