Apple Inc. in Santa Clara, CA, is seeking a senior IC packaging engineer to lead packaging development for SoCs. You will collaborate with cross-functional teams to drive advanced package solutions, new materials, and reliability across designs.
The role requires BS plus 10+ years in semiconductor packaging, with preference for MS/PhD and expertise in FOWLP/2.5D/3D, Allegro schematics review, and data analytics to optimize yield and performance.
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