Annapurna Labs, an AWS organization, is seeking a Sr. Package Layout Engineer to lead end-to-end physical design of advanced IC packages for data center accelerators.
You will own package layout from floor planning to tape-out, driving 2.5D/3D-IC and interposer architectures with cross-functional teams. Expect to collaborate with silicon, SI/PI, thermal and manufacturing groups to meet performance, density and reliability targets.
#J-18808-LjbffrSenior IC Package Layout Lead (2.5D/3D-IC) in az at Unknown Company
This position is listed as full time and onsite.