Apple Inc. seeks a Package Design Engineer in Austin to drive the physical design of advanced semiconductor packages across SoC, memory, RF, and cellular tech. You will shape architecture, scalability, and efficiency while advancing design methodologies with automation and AI.
You will lead package architecture, optimize configurations, and own Package/SiP/module physical design from concept to tape-out, collaborating with cross-functional teams and applying AI to improve design quality and pace.
#J-18808-LjbffrSenior IC Package Design Engineer, SiP/SoC AI-Driven in austin at Unknown Company
This position is listed as full time and onsite.