Company: Qualcomm Technologies, Inc.
Job Area: Engineering Group > Hardware Engineering
General Summary
This position is for the Post Silicon Engineering group that develops test solutions for highly integrated SOCs (System on Chip) designed by Qualcomm.
Main Responsibilities
- Define and execute development of test methodologies and characterization of high‑speed SERDES interfaces such as PCIe, USB4, UFS, DP, MIPI (DSI, CSI), PLLs and other proprietary interfaces.
- Develop and execute characterization plans for these interfaces to optimize design parameters and validate electrical compliance, drive first‑silicon bring‑up & debug to qualify designs fabricated at external foundries and perform technical data analysis of parametric performance over various operating conditions and configurations.
- Assist in hardware design and debug of power integrity (PI) and signal integrity (SI) issues related to package and board design.
- Collaborate closely with cross‑functional teams such as IC Design and Systems Engineering for chip/circuit bring‑up and debug.
- Work with Customer Engineering and Hardware Applications teams to resolve customer issues/RMA debug in a time‑critical environment.
Required Qualifications
- Bachelor’s degree in Electronics/Electrical/Computer Engineering or related field.
- 5+ years of high‑speed silicon validation experience.
Preferred Qualifications
- Master’s degree in Electronics/Electrical/Computer Engineering or related field.
- 3+ years of experience in related areas.
- Good understanding of VLSI technologies, CMOS analog/digital integrated circuits, mixed‑signal and semiconductor physics.
- Experience with high‑speed test and characterization including eye diagram characteristics, receiver JTOL performance, jitter analysis, signal integrity, etc.
- Familiarity with SERDES transmitter/receiver design blocks.
- Hands‑on experience with lab equipment such as oscilloscopes, TDRs/VNAs, J‑BERT, etc.
- Experience with Python/C# for test automation.
- Familiarity with board‑design concepts (schematic reviews, layout best practices, etc.) is a plus.
- Good ASIC device‑level characterization skills. System‑level knowledge is a plus.
- Strong verbal and written communication skills, organization and documentation skills.
- Strong problem solving & debugging skills. Ability to work independently and with good initiative.
- Strong interpersonal and teamwork skills with proven ability to work effectively in a fast‑paced multi‑disciplinary environment.
Minimum Qualifications
- Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of hardware engineering or related work experience.
- OR Master’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of hardware engineering or related work experience.
- OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
EEO Statement
Qualcomm is an equal‑opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Pay Range and Other Compensation & Benefits
$111,300.00 – $166,900.00. This pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunities for annual RSU grants. Our benefits package is designed to support your success at work, at home, and at play.
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