A technology development firm in California is seeking a Senior Package Design Engineer to work on high-performance package substrate design. You will collaborate with cross-functional teams to ensure signal and power integrity, utilizing tools like HFSS and ADS. The ideal candidate possesses 8-10 years of semiconductor package design experience and strong skills in analysis, modeling, and communication. This role offers a competitive annual salary ranging from $190,000 to $220,000.
#J-18808-Ljbffr
#J-18808-Ljbffr