Senior Engineer, Package DesignSalary: $$ - $$ per yearLocation: San Jose, CaliforniaMinimum Degree: BS in EE or related field; MS preferredRelocation Assistance: AvailableJob DescriptionRole Summary: We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. You’ll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing.Key Responsibilities:Perform package substrate design and analysis (SI/PI/routing)Collaborate with layout engineers, marketing, and global design teamsUse tools like HFSS, ADS for package modeling/simulationContribute during pre/post-sales processesQualifications8-10 years of experience in semiconductor package designStrong SI/PI analysis, modeling, and simulation skillsExcellent communication, teamwork, and presentation abilitiesPreferred Skills:Expertise in high-speed package/PCB design (SerDes, PCIe, LPDDR, Ethernet)Time/frequency domain analysis, impedance, jitter, eye-diagram, BER analysisExperience with Hspice, Redhawk, electro-thermal simulation, PDN modelingFamiliarity with reliability analysis and packaging/assembly rulesWhy is This a Great OpportunityOutstanding technology, great opportunity to learn.
Growing company with a lot of IP. Everyone contributes.