Johns Hopkins Applied Physics Laboratory (APL) seeks an Electronics Packaging Engineer to lead the design of electromechanical hardware from concept through delivery, including thermal and structural analysis, detailed design, assembly, and testing.
You will collaborate with teams of engineers and scientists across mission areas, participate in design reviews, mentor junior members, and support a fast-paced, secure environment with occasional travel and a requirement to obtain a Secret level
#J-18808-LjbffrSenior Electronics Packaging Engineer Thermal & Structural in laurel at Unknown Company
This position is listed as full time and onsite.