SBT's client is developing a groundbreaking technology platform that combines advanced materials with silicon photonics to accelerate AI workloads. The Head of Packaging will shape the company's packaging strategy and lead a multidisciplinary team of engineers and scientists to deliver reliable, manufacturable solutions for multi-chip packages and high-speed silicon photonics devices.
You will partner with silicon photonics and electrical engineers, design robust testing regimes, and produce
#J-18808-LjbffrSenior Director Photonic Packaging & High-Speed Integration in san francisco at Unknown Company
This position is listed as full time and onsite.