Micron Technology, Inc. is seeking a Process Integration Lead for Advanced Packaging to head a team driving 2.5D/3D packaging and HBM integration from concept through manufacturing.
You will shape roadmaps, mentor engineers, and deliver high-performance multi-die solutions across global operations. You will lead technology transfer, DOE-driven development, and collaboration across design, process, equipment, reliability, and test teams, ensuring robust qualification and scalable processes for
#J-18808-LjbffrSenior Director, Advanced Packaging Process Integration in boise at Unknown Company
This position is listed as full time and onsite.