Amkor Technology, Inc. in Tempe, AZ is seeking a senior Director of Advanced Packaging and Wafer Services to lead strategic and technical roadmaps for next‑gen wafer‑based IC packages, including HDFO, 2.5D and chiplet architectures for computing, networking, AI and mobile markets.
The role is customer‑facing and will interface with Tier 1 customers, Amkor's global R&D centers and cross‑functional teams to drive program execution, development to production ramp, and technology commercialization
#J-18808-LjbffrSenior Director, Advanced Packaging & Wafer Technologies in phoenix at Unknown Company
This position is listed as full time and onsite.