Amkor Technology in Tempe, AZ seeks a senior Director of Advanced Packaging and Wafer Services to lead development and commercialization of wafer-based IC package platforms, including HDFO, 2.5D, and chiplet architectures for computing, networking, AI and mobile markets.
The role combines strategic leadership with hands-on program management, guiding cross-functional teams across global R&D and customer engagements to transition technologies from development to production ramp.
#J-18808-LjbffrSenior Director, Advanced Packaging & Wafer Tech in tempe at Unknown Company
This position is listed as full time and onsite.