Amkor is seeking a senior Director of Advanced Packaging and Wafer Services for the Tempe, AZ office. This role leads development and commercialization of advanced wafer-based IC package platforms, including 2.5D and chiplet architectures for computing and AI.
The candidate will serve as a senior customer-facing leader and primary interface with Tier 1 customers, Amkor’s global R&D centers, and cross-functional teams to drive roadmaps, program execution, and transition from development to
#J-18808-LjbffrSenior Director, Advanced Packaging and Wafer Services in tempe at Unknown Company
This position is listed as full time and onsite.