- Proven history of architecting complex digital hardware.
- Knowledge of board level digital design process from schematic capture, implementation, integration, and verification.
- Experience designing with Gigahertz microprocessors, FPGA, CPLD, DDR4 memory, flash memory.
- Experience with large pin count devices, 1000+ pins with 0.8mm device pitch or smaller
- Experience in High Density Interconnect (HDI) technologies (micro vias, buried / blind vias, back drilling) for IPC Class 3 board.
- Experience in design of 5+ Gbps serial links. (10GBASE-KR, PCIe Gen3, Fiber Optics)
- Experience designing with CAN, MIL-STD-1553, ARINC 429, ARINC 664, TSN.
- Experience with OpenVPX and PIC-SIG standards.
- Experience in the Mil/Aero/avionics, DO-254 and Civil FFA Certification.
- Strong professional technical writing and technical communication proficiency.
- Ability to break down complex problems and apply critical thinking.
- Familiarity with the Mentor Graphics Expedition Enterprise and Hyperlinx PI/SI.
- Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, Microsoft Visio.
#J-18808-Ljbffr