Qnity seeks a highly motivated Senior R&D Scientist to lead the development of next-generation copper electroplating chemistries for dual damascene interconnects. You will design and scale advanced Cu plating processes to enable future semiconductor nodes with improved feature filling and reliability.
Partner with cross-functional teams to drive IP generation, customer-facing projects, and manufacturing scale-up from lab to pilot lines. Strong experimental skills and collaboration are essential.
#J-18808-LjbffrSenior Copper Electroplating Scientist for Interconnects in marlborough at Unknown Company
This position is listed as full time and onsite.