Micron Technology, Inc. is seeking a skilled Equipment Engineer to install, start up, and continuously improve advanced semiconductor processing equipment in Boise, ID.
You will work with process engineering and vendors to enable leadership in next-gen memory and drive module-level development on large technical projects. The role requires a Bachelor's in engineering/related field and 2 years of experience in CMP/Bond processes, experimental design (DOE), data analysis, and problem solving.
#J-18808-LjbffrSenior CMP/Bond Equipment Engineer: Lead Module Development in boise at Unknown Company
This position is listed as full time and onsite.