Micron Technology, Inc in Boise, Idaho is seeking a Senior Process Engineering Technical Leader focusing on chip-to-wafer and hybrid bonding. The ideal candidate will lead the development and scale-up of bonding processes for high-performance 3D memory products, collaborating across various teams to ensure repeatability and readiness for high-volume manufacturing.
Requirements include a Master’s degree or PhD in a relevant field, along with 13+ years of experience in semiconductor R&D, specifically in advanced packaging. Micron offers comprehensive benefits including medical plans and paid family leave.
#J-18808-LjbffrSenior Chip-to-Wafer & Hybrid Bonding Lead in boise at Unknown Company
This position is listed as full time and hybrid.