Meta is seeking an experienced ASIC Package Engineer to own package-to-board attach processes for its AI/ML and networking silicon. You will lead development, qualification, and optimization of packaging interfaces, collaborating with PQE, SQE, and module design teams to deliver robust, high-yield manufacturing flows for data-center hardware.
Applicants should have 8+ years in semiconductor packaging, with strong experience in solder paste printing, reflow soldering, inspection, and DOE-based
#J-18808-LjbffrSenior ASIC Package Engineer: Board-Attach & Yield Expert in austin at Unknown Company
This position is listed as full time and onsite.