Broadcom Inc. seeks an experienced IC Package Design Manager to lead a team of engineers designing complex flip‑chip‑BGA packages for ASICs with high‑speed SerDes and high power delivery.
You will guide technical methodologies and project management for a worldwide R&D effort focused on AI, HPC, networking, and 5G applications. The role requires 12+ years in flip‑chip‑BGA package design, including high‑speed SerDes, and at least 3 years in management, with strong SI/PI awareness and DFx
#J-18808-LjbffrSenior ASIC Package Design Manager - Lead SerDes in fort collins at Unknown Company
This position is listed as full time and onsite.