Micron Technology, Inc. seeks a veteran organizational leader to guide and influence advanced packaging process development for memory products (HBM, 3DS DRAM, 3D architectures).
You will drive end-to-end technology execution, partner across functions, and shape internal roadmaps and external ecosystems. The role emphasizes data-driven decision-making, AI-enabled tooling, and collaboration with suppliers and R&D to accelerate learning and deliver high-impact solutions.
#J-18808-LjbffrSenior Advanced Packaging Process Leader in boise at Unknown Company
This position is listed as full time and onsite.