Apple's Advanced Packaging Program in San Francisco seeks engineers to drive package integration and technology development for next‑generation products. You will work with world‑class engineers to translate 2.5D/3D packaging concepts from concept to mass production.
You will collaborate with foundries, define specs, run DOEs and NPIs, lead tapeouts, and apply data analytics to optimize yield and reliability while shaping packaging architectures and DFM with IC layout tools.
#J-18808-LjbffrSenior Advanced Packaging Engineer — 2.5D/3D Solutions in san francisco at Unknown Company
This position is listed as full time and onsite.