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Senior Advanced Packaging Engineer: 2.5D/3D & SiP

california, mo • Posted 1 weeks ago
Onsite Full Time Engineering

Renesas Electronics is seeking a Senior Advanced Packaging Engineer in California to lead the development and integration of innovative packaging solutions for high-performance electronics. You will be responsible for designing and qualifying next-generation semiconductor packaging while collaborating with various engineering teams.

The ideal candidate should hold an MSc or PhD in a relevant field and have over 5 years of experience in semiconductor packaging. The role offers exciting short-term and long-term incentive opportunities based on performance.

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