Entrada Ventures, a Silicon Valley–based startup, seeks a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators. You will drive package architecture, substrate design, manufacturability, and vendor engagement in a fast-paced environment.
You will partner with IC design, physical design, and board teams to meet system-level needs, evaluate new packaging technologies, and support bring-up and qualification across internal sites and
#J-18808-LjbffrSenior 3D Packaging Architect for AI Accelerators in palo alto at Unknown Company
This position is listed as full time and onsite.