GlobalFoundries is seeking an experienced R&D engineer to lead advanced 3D Heterogeneous Integration initiatives in the Advanced Packaging Lab. You will drive BEOL process development, bonding, TSVs, and wafer-to-wafer integration while partnering with process and manufacturing teams.
You will guide project teams, analyze data, and address failure modes to enable new capabilities and early prototyping across programs in a large-scale semiconductor environment.
#J-18808-LjbffrSenior 3D-HI Packaging Engineer in essex junction at Unknown Company
This position is listed as full time and onsite.