GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) to lead 3D-Heterogeneous Integration initiatives across multiple application domains. You will drive 3D-HI process development for multi-die stacking, die-to-wafer/wafer-to-wafer bonding, and collaborate with BEOL, TSVs, and OSAT partners to enable early prototyping.
Required qualifications include a Master’s in Electrical/Mechanical/Chemical Engineering or Materials Science with 4–5 years of related
#J-18808-LjbffrSenior 3D Heterogeneous Integration Engineer in town of malta at Unknown Company
This position is listed as full time and onsite.