Arizona State University is seeking a Senior Process Engineer for the Advanced Electronics and Packaging Core Facility in Tempe. The role focuses on wafer prep and finishing, including die attach, molding, grinding, wafer saw, and ball drop/reflow, with development on 300mm tooling and ownership of dicing saw and wafer grinders.
Working with device physics, deposition, etching, photolithography, and electrical test, you will ensure robust packaging processes, improve yields, and support
#J-18808-LjbffrSenior 300mm Wafer Packaging Engineer in tempe at Unknown Company
This position is listed as full time and onsite.