Broadcom, Inc. is seeking an Advanced Package Technology Engineer in Fort Collins, CO to drive 2.5D/3D packaging technology.
You will collaborate with silicon and package design, marketing, NPI, and suppliers to define needs and deliver high-performance, cost-effective packaging that meets signal integrity and thermal requirements. As Technology Leader, you will oversee 2.5D/3D development, manage external partners for qualification, and work with cross-functional teams on design, test, and
#J-18808-LjbffrSenior 2.5D/3D Packaging Engineer in fort collins at Unknown Company
This position is listed as full time and onsite.