We are seeking an experienced and highly motivated Semiconductor Process Applications Engineer to join our team. We are a leading capital equipment company specializing in sub-micron die bonding solutions for the semiconductor industry. This role is ideal for professionals with several years of hands-on experience in semiconductor manufacturing and advanced packaging processes. The successful candidate will play a key role in supporting our sales team, interfacing with our customers, and driving technical success for our cutting-edge, die-bonding equipment.
Key Responsibilities
* Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies like quantum computing and brain-machine interface.
* Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
* Collaborate with customers to understand application requirements and develop customized process solutions.
* Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
* Provide technical training to customers and internal staff on equipment operation and process optimization.
* Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
* Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
* Represent the company at industry events, conferences, and customer meetings as a technical expert.
Qualifications
* Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
* Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
* Proven expertise working with die bonding, wire bonding, or related semiconductor assembly equipment.
* Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.
* Excellent problem-solving skills and the ability to troubleshoot complex hardware and process issues.
* Outstanding communication and interpersonal skills; ability to present technical information clearly to diverse audiences.
* Able to work daily from our office and demo lab in Chandler, AZ. Willingness to travel domestically and internationally as required (up to 30%).
Preferred Skills
* Customer-focused mindset with a proactive approach to solving challenges.
* Team player able to collaborate across departments and with external partners.
* Adaptable and eager to learn about new technologies and industry trends.
* Self-motivated, organized, and able to manage multiple priorities effectively.
* Familiarity with advanced packaging trends such as flip-chip, wafer-level bonding, and heterogeneous integration.
Why Join Us?
Become part of an innovative, close-knit team at the forefront of semiconductor assembly technology. You will have the opportunity to make a tangible impact on the industry, work with cutting-edge equipment, and advance your career in a collaborative environment that offers a competitive salary and a comprehensive benefits package. #J-18808-Ljbffr
Key Responsibilities
* Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies like quantum computing and brain-machine interface.
* Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
* Collaborate with customers to understand application requirements and develop customized process solutions.
* Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
* Provide technical training to customers and internal staff on equipment operation and process optimization.
* Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
* Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
* Represent the company at industry events, conferences, and customer meetings as a technical expert.
Qualifications
* Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
* Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
* Proven expertise working with die bonding, wire bonding, or related semiconductor assembly equipment.
* Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.
* Excellent problem-solving skills and the ability to troubleshoot complex hardware and process issues.
* Outstanding communication and interpersonal skills; ability to present technical information clearly to diverse audiences.
* Able to work daily from our office and demo lab in Chandler, AZ. Willingness to travel domestically and internationally as required (up to 30%).
Preferred Skills
* Customer-focused mindset with a proactive approach to solving challenges.
* Team player able to collaborate across departments and with external partners.
* Adaptable and eager to learn about new technologies and industry trends.
* Self-motivated, organized, and able to manage multiple priorities effectively.
* Familiarity with advanced packaging trends such as flip-chip, wafer-level bonding, and heterogeneous integration.
Why Join Us?
Become part of an innovative, close-knit team at the forefront of semiconductor assembly technology. You will have the opportunity to make a tangible impact on the industry, work with cutting-edge equipment, and advance your career in a collaborative environment that offers a competitive salary and a comprehensive benefits package. #J-18808-Ljbffr
Semiconductor Process Applications Engineer in chandler at Unknown Company
This position is listed as full time and onsite.