A semiconductor company based in Lowell, Massachusetts is seeking an experienced RFIC Packaging Engineer to lead packaging development from concept to production. The ideal candidate will have a strong background in materials science and extensive experience in RF and Microwave IC assembly processes. Responsibilities include troubleshooting packaging defects, collaborating with teams to qualify technologies, and ensuring high-volume manufacturability. The compensation range for this position is between $83,000 and $136,000, depending on experience and qualifications.
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RFIC Packaging Engineer – Lead NPI for RF/Microwave Packages in lowell at Unknown Company
This position is listed as full time and onsite.