Device And Integration EngineerGlobalFoundries is a leading full-service semiconductor foundry with a global manufacturing footprint spanning three continents. GlobalFoundries' RF Technology Development Organization is looking for a device and integration engineer in developing semiconductor technologies to join our RF team in Essex Junction, VT.Essential Responsibilities include:Responsible for development, optimization, and qualification of FEOL and BEOL semiconductor devices and processes to meet performance, cost and yield requirementsDesign, electrical characterization and analysis of RF devices including FET, bipolar, diodes and passives.Conduct theoretical studies or simulations to optimize the device performance and benchmark it against state of the artResponsible for the DC and RF characterization and analysis including s-parameter, noise figure and loadpullDOE design, execution, and analysis of results.Partner with unit process module engineers, failure analysis and characterization team to improve device performance and yieldOwn and drive technical process problem solving.Interact with internal & external customers and respond to technical queries.Establish new technology design rules, test structures and test methodologies.Innovate new methods of continuous process/device improvement.Other Responsibilities:Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.Required Qualifications:Education – Graduating with Master's or PhD in Electrical, Materials Science, or other relevant engineering or physical science discipline from an accredited degree program.Background in CMOS device physics, semiconductor processing, and characterizationStrong data analysis skillsExcellent interpersonal skills, both oral and writtenMust have at least an overall 3.0 GPA and proven good academic standing.Language Fluency - English (Written & Verbal)Preferred Qualifications:Experience in Silicon or SiGe BiCMOS FEOL or BEOL processing and/or semiconductor process developmentExperience in RF device design and characterization including high frequency design, measurement and analysisExperience with Cadence or any other layout and simulation toolPrior related internship or co-op experience.Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.Strong written and verbal communication skillsStrong planning & organizational skillsExpected Salary Range$85,000.00 - $146,000.00The exact Salary will be determined based on qualifications, experience and location.