RF/Microelectronics Packaging Engineer Jobs

We are seeking ann Packaging Engineern nto lead end-to-end packaging development for advanced microelectronic and RF communication products. This role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules.n
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nYou will own the full packaging lifecycle-from concept and definition through design, modeling, testing, and production release-while partnering closely with cross-functional engineering teams and external vendors. This position requires deep technical expertise in semiconductor packaging, strong problem-solving skills, and the ability to drive development in a fast-paced, high-reliability environment.n
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nn Responsibilitiesn n
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• n Collaborate with product development teams (RFIC, MMIC, and module engineering) to design and deliver next-generation packaging solutions for RF communication systemsn
• n Define package architectures, materials, and processes that meet performance, reliability, manufacturability, and cost requirementsn
• n Lead packaging efforts for new product introductions (NPI) and new technology developmentn
• n Develop and manage packaging documentation, including statements of work (SOWs), drawings, and process flowsn
• n Design and layout semiconductor packages such as QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP, and interposersn
• n Utilize modeling and simulation (thermal, mechanical, electrical) to ensure early-stage design successn
• n Provide technical oversight to external vendors and manufacturing partners throughout package fabricationn
• n Apply expertise in assembly processes (die attach, wirebond, bumping, overmolding) to guide design decisions and troubleshoot issuesn
• n Evaluate and recommend packaging solutions through feasibility studies for new productsn
• n Partner with engineering teams to optimize packaging for cost and performancen
• n Define and oversee reliability testing to ensure product robustness and compliancen
• n Coordinate cross-functional efforts across design, test, quality, manufacturing, and supply chain teamsn
• n Identify and resolve material and process challenges during developmentn
• n Manage packaging projects using industry-standard tools and methodologiesn
• n Contribute to long-term packaging technology roadmaps and support proposal effortsn
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n Qualificationsn n
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• n 10+ years of experience in semiconductor packaging, including package engineering, assembly processes, and reliabilityn
• n Bachelor's degree in Electrical, Mechanical, Materials Engineering, or a related technical fieldn
• n Strong understanding of microelectronic packaging, including mechanical, electrical, and thermal performance considerationsn
• n Solid foundation in heat transfer and material propertiesn
• n Experience supporting RFIC, millimeter wave, SiP, or module-based productsn
• n Hands-on experience with package design technologies such as QFN, SiP, BGA, WL-CSP, Flip Chip, bumping, or FO-WLPn
• n Knowledge of semiconductor assembly processes, including die prep, die attach, wirebonding, flip chip, and SMTn
• n Familiarity with interconnect reliability testing (e.g., daisy chain, CPI, BLR)n
• n Understanding of metallization schemes for laminates, interposers, and SMTn
• n Experience with statistical analysis and design of experiments (DOE)n
• n Ability to operate independently and drive technical decisions in ambiguous environmentsn
• n Strong communication and collaboration skills across cross-functional teamsn
• n Experience translating system or IC requirements into packaging solutionsn
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n Additional Requirementsn n
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• n U.S. Citizenship requiredn
• n Ability to travel up to 10%n
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