Syenta, based in Tempe, Arizona, seeks a highly skilled professional for substrate IC package design, focusing on advanced multi-layered interposers.
The role emphasizes electrical, thermal, and mechanical design collaboration. Candidates should have extensive experience in high-performance processor packaging and utilize tools like Allegro Package Designer. Salary ranges from $130k to $160k, with additional equity and benefits. #J-18808-Ljbffr
Remote Substrate IC Package Design Engineer (High-Speed) in tempe at Unknown Company
This position is listed as full time and onsite.