TE Connectivity is seeking an experienced engineering leader to manage the integrated Hardware and Signal Integrity organization for high-speed external cable assemblies. You will own the lifecycle from architecture through production release, driving DAC/ACC/AEC architectures for OSFP, QSFP-DD, and related form factors in Ethernet, AI infrastructure, and PCIe.
Based in Troy, MI, this role leads global teams across hardware, PCB design, SI/PI analysis, and validation, delivering robust, scalable
#J-18808-LjbffrRemote Lead, High-Speed R&D & Signal Integrity Engineering in workfromhome at Unknown Company
This position is listed as full time and onsite.