A leading AI technology company is looking for a skilled Physical Design Engineer to oversee Die-to-Die physical implementations. This remote position requires expertise in high-speed interfaces and full physical design flow. Candidates should have at least 5 years of experience in ASIC design and a relevant degree. The role includes owning full PD flow, driving tapeout processes, and collaborating with multiple teams. Competitive compensation is offered, ranging from $100k to $500k, depending on qualifications.
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Remote Die-to-Die PD Engineer for High-Speed AI Chip in Remote at Unknown Company
This position is listed as full time and able to be worked remotely.