Intel Corporation in Oregon is seeking an experienced Quantum Packaging SI/PI Engineer to model and simulate packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team.
The role emphasizes SI/PI modeling, validation, and optimization using tools like SIwave, HFSS, and ADS. Collaboration with hardware teams and stakeholders is essential to meet ambitious quantum packaging goals in a fast-paced research environment.
#J-18808-LjbffrQuantum Packaging SI/PI Engineer - Shape Quantum Hardware in hillsboro at Unknown Company
This position is listed as full time and onsite.