TIE is seeking Product Engineers to validate products, optimize manufacturing/test workflows, and contribute to 2.5D/3D packaging solutions. You will develop 3D modeling accuracy, define DFT/DFM requirements, and support 3D-ADK.
Strong programming and data analysis skills are required, with experience in semiconductor design or packaging advantageous. The role involves cross-functional collaboration, DOE execution, and driving yield/reliability improvements across lifecycles, with a focus on
#J-18808-LjbffrProduct Engineer I–II: Semiconductor Packaging & Yield in austin at Unknown Company
This position is listed as full time and onsite.