Micron Technology, Inc. is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D architectures, including HBM, and to drive reliability and performance improvements across cross-functional teams.
You will design experiments, qualify materials, and transfer new processes to manufacturing, while addressing wafer warpage and performance optimization in high-volume production environments.
#J-18808-LjbffrProcess Integration Engineer: 2.5D/3D Packaging & HBM in boise at Unknown Company
This position is listed as full time and onsite.