Process Engineer (Metallization)Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.Founded in Australia, our growing footprint in the US represents a key milestone in our journey.
We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.We are seeking a Process Engineer (Metallization) to support the development and optimization of Syenta's core LEM metallization processes. This is a hands-on, high-impact role working at the heart of our technology — bridging experimental R&D, process engineering, and early-stage manufacturing.You will take ownership of designing and executing experiments, improving process performance, and translating learnings into robust, repeatable workflows. Working closely with cross-functional teams, you will play a key role in advancing our prototype systems toward scalable production.Electroplating Process OwnershipSupport the development and performance of electroplating processes within Syenta's LEM platformDevelop and refine electrolyte chemistries, including optimization of additive systems (suppressors, accelerators, levellers, inhibitors)Define electrochemical deposition windows that balance performance, repeatability, and manufacturabilityDrive improvements in film properties including adhesion, stress, microstructure, uniformity, and defectivityProcess Development & OptimizationDesign and execute structured experiments (DOE, parameter sweeps) across tightly coupled chemical and process variablesOptimise deposition conditions (e.g.
current density, waveform, transport effects) to improve yield and consistencyEstablish process control strategies, acceptance criteria, and repeatability standardsTranslate experimental results into actionable process improvementsDefect Analysis & Process ImprovementInvestigate plating defects such as voids, seams, roughness, non-uniformity, stress cracking, and adhesion failuresCorrelate defects to chemistry, interfaces, transport, waveform, and tool behaviorImplement corrective actions to improve process robustness and reduce variabilityBuild mechanistic understanding to support long-term stability and scalabilityScale-Up & Manufacturing IntegrationTranslate lab-scale processes into stable, repeatable manufacturing workflowsSupport process transfer to pilot lines and external fabrication partnersIdentify and mitigate risks related to yield, cost, and scalabilityContribute to process standardization and documentation for manufacturing readinessTechnical Leadership & Cross-Functional CollaborationAct as a subject matter expert in electroplating and electrochemistry within the organizationWork closely with materials, hardware, and product teams to integrate metallization processes into the broader systemRequirementsB.S., M.S., or Ph.D. or equivalent industry experience in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering5+ years of hands-on experience in electroplating or electrochemical process developmentStrong experience with copper electroplating or similar metal deposition systemsBackground in semiconductor manufacturing, advanced packaging, or related high-precision industriesProven ability to solve complex process and defect-related challengesStrong experimental design (DOE), data analysis, and problem-solving capabilitiesExperience working in laboratory and/or cleanroom environmentsPreferred QualificationsExperience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environmentsExperience scaling processes from R&D through to manufacturingFamiliarity with metrology and characterization tools (SEM, profilometry, electrical testing)Experience working with prototype or custom-built hardware systemsExposure to adjacent industries (PCB, MEMS, surface finishing) with relevance to high-resolution systemsWe're passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.What We OfferSalary Range: US $100k – $130k (negotiable)Early-stage equity opportunitiesPotential 401(k) and other benefitsComprehensive health, dental, and vision coverage plans, supported by CompanyProfessional Growth – We're scaling fast, so responsibilities can expand significantly in tandem with the businessTeam Events – Annual company event in Australia to collaborate and celebrateWork-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life15 days PTO and 10 days sick leaveSyenta is an Equal Opportunity Employer.
We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.