Job TitleJoin Applied Materials to push the boundaries of materials science and engineering to create next generation technology.Job DescriptionApplied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.Role ResponsibilitiesDesign, collect data, analyze, and compile reports on difficult process engineering experiments. Perform hardware characterization on a variety of difficult systems. Troubleshoot complex problems, perform Root Cause Analysis, and resolve a variety of difficult process engineering issues. Measure film properties and interpret data. Generate internal documentation for products, presentations, and technical reports.
Communicate and engage with customers to resolve complex process engineering issues or concerns, under limited supervision. Identify, select, and partner with vendors and suppliers. Implement new technology, products, and analytical instrumentation. Serve as a resource for junior colleagues; lead project teams, as needed.Minimum QualificationsBachelor's degree in a related field, advanced degree preferred. 4-7 years of related experience. Demonstrates conceptual and practical expertise in complex problem solving.QualificationsBS or MS Degree in Electrical, Chemical or Mechanical Engineering, Materials Science, Physics, or a related field. Strong analytical skills and proficiency in data analysis.
Familiar with device packaging, W2W /D2W bonding. Excellent communication and teamwork skills. Ability to work independently and manage multiple tasks effectively. Attention to detail and a proactive approach to problem-solving.Preferred QualificationsExperience with electronic packaging fabrication such W2W and D2W bonding. Previous hand-on experience with tool operation and process development in PCB or semiconductor industry.Additional InformationTime Type: Full time. Employee Type: Assignee / Regular. Travel: Yes, 10% of the Time.
Relocation Eligible: Yes. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.